| 規 格：15G |
型 號：CV5300AK01EPS |
數 量：1000支 |
| 品 牌：松下 |
包 裝：針管 |
價 格：面議 |
原裝進口松下底填膠CV5300AK01EPS耐高溫芯片倒裝底填膠 This is
one component epoxy for Flip-chip
underfilling. TYPICAL PROPERTIES
|
Properties
|
Unit
|
Data
|
Test Method
|
|
Viscosity(25oC)
|
Pa*s
|
20
|
KES-B-0102
|
|
Gelation
time
|
sec
|
800
|
EKS-B-1051
|
RECOMMENDING PREHEAT CONDITION
temperature
of substrate : 80～120oC temperature of syringe : R.T.～ 60oC TYPICAL CURED PROPERTIES Measurement Cure Conditions : 100C2hour + 150`C 2hour
|
Properties
|
Unit
|
data
|
Test
Method
|
|
Glass Trans.
Temp.
|
oC
|
160
|
KES-F-0001
|
|
C.T.E.
|
×10-5/oC
|
2.5
|
KES-F-0001
|
|
Flexural
Strength
|
MPa
|
160
|
KES-E-0104
|
|
Flexural
Modulus
|
GPa
|
9
|
KES-E-0104
|
|
Volume
Resistivity
|
Ω*cm
|
5×1015
|
KES-G-0023
|
|
Extractable
Inpurity
ion
|
ppm
|
Na+ : 4
|
KES-I-2011 A)
|
|
Cl- : 8
|
|
Conductivity
|
mS/m
|
4
|
KES-I-2001 A)
|
|
原裝進口松下底填膠CV5300AK01EPS耐高溫芯片倒裝底填膠 |
|
